Intel/Altera
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产品详情请参阅规格.
产品详情请参阅规格.
EN6337QI
EN6337QI
型号
EN6337QI
类目
Power IC > Power Module
制造商/品牌
Intel/Altera
封装
QFN-38-EP(4x7)
包装
taping
包裹数量
500
简介
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有货 78790 PCS
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About Altera Corporation
Altera Corporation was an American manufacturer of programmable logic devices (PLDs), reconfigurable complex digital circuits. It was acquired by Intel Corporation in 2015 and is now a subsidiary of Intel.
Founded in 1983, Altera was one of the pioneers in the field of programmable logic, offering a range of PLD products including field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and specialized chips for digital signal processing and memory interface functions. The company's products were used in a variety of applications including communication systems, industrial automation, medical equipment, and military systems.
Altera was known for its innovation in the PLD market, including the development of high-density FPGAs and low-power, high-performance CPLDs. With its acquisition by Intel, Altera continues to provide PLD solutions for its customers, leveraging the resources and technology of one of the world's largest technology companies.
*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.
Altera Corporation was an American manufacturer of programmable logic devices (PLDs), reconfigurable complex digital circuits. It was acquired by Intel Corporation in 2015 and is now a subsidiary of Intel.
Founded in 1983, Altera was one of the pioneers in the field of programmable logic, offering a range of PLD products including field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and specialized chips for digital signal processing and memory interface functions. The company's products were used in a variety of applications including communication systems, industrial automation, medical equipment, and military systems.
Altera was known for its innovation in the PLD market, including the development of high-density FPGAs and low-power, high-performance CPLDs. With its acquisition by Intel, Altera continues to provide PLD solutions for its customers, leveraging the resources and technology of one of the world's largest technology companies.
*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.
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Non-Isolated PoL Module DC DC Converter 1 Output 0.6 ~ 6.285V 3A 2.5V - 6.6V Input
Pin Count--------39
Part Category--------Integrated Circuit
Package Category--------Other
Footprint Name--------Other - EN6337QI-1
Pin Count--------39
Part Category--------Integrated Circuit
Package Category--------Other
Footprint Name--------Other - EN6337QI-1
more_faq
EN6337QI Frequently Asked Questions (FAQs)
What is the recommended PCB layout for optimal thermal performance?
A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
How do I ensure reliable operation in high-temperature environments?
Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
What are the specific requirements for power sequencing and voltage ramp-up?
Power sequencing should follow the recommended sequence: VCC, VCCP, and VTT. Voltage ramp-up should be controlled to avoid overshoot and ensure a monotonic rise.
How do I optimize the EN6337QI for low-power operation?
Implement power gating, dynamic voltage and frequency scaling, and optimize the clock tree. Use the device's built-in power management features and consider using a low-power mode.
What are the recommended EMI and RFI mitigation strategies?
Use a multi-layer PCB with a solid ground plane, implement good signal routing practices, and consider using shielding and filtering components. Ensure proper decoupling and bypassing of power supplies.
What is the recommended PCB layout for optimal thermal performance?
A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
How do I ensure reliable operation in high-temperature environments?
Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid thermal hotspots.
What are the specific requirements for power sequencing and voltage ramp-up?
Power sequencing should follow the recommended sequence: VCC, VCCP, and VTT. Voltage ramp-up should be controlled to avoid overshoot and ensure a monotonic rise.
How do I optimize the EN6337QI for low-power operation?
Implement power gating, dynamic voltage and frequency scaling, and optimize the clock tree. Use the device's built-in power management features and consider using a low-power mode.
What are the recommended EMI and RFI mitigation strategies?
Use a multi-layer PCB with a solid ground plane, implement good signal routing practices, and consider using shielding and filtering components. Ensure proper decoupling and bypassing of power supplies.
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