Intel/Altera
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产品详情请参阅规格.
产品详情请参阅规格.
EN6347QI
EN6347QI
型号
EN6347QI
类目
Power IC > Power Module
制造商/品牌
Intel/Altera
封装
QFN-38-EP(4x7)
包装
taping
包裹数量
500
简介
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有货 87038 PCS
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About Altera Corporation
Altera Corporation was an American manufacturer of programmable logic devices (PLDs), reconfigurable complex digital circuits. It was acquired by Intel Corporation in 2015 and is now a subsidiary of Intel.
Founded in 1983, Altera was one of the pioneers in the field of programmable logic, offering a range of PLD products including field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and specialized chips for digital signal processing and memory interface functions. The company's products were used in a variety of applications including communication systems, industrial automation, medical equipment, and military systems.
Altera was known for its innovation in the PLD market, including the development of high-density FPGAs and low-power, high-performance CPLDs. With its acquisition by Intel, Altera continues to provide PLD solutions for its customers, leveraging the resources and technology of one of the world's largest technology companies.
*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.
Altera Corporation was an American manufacturer of programmable logic devices (PLDs), reconfigurable complex digital circuits. It was acquired by Intel Corporation in 2015 and is now a subsidiary of Intel.
Founded in 1983, Altera was one of the pioneers in the field of programmable logic, offering a range of PLD products including field-programmable gate arrays (FPGAs), complex programmable logic devices (CPLDs), and specialized chips for digital signal processing and memory interface functions. The company's products were used in a variety of applications including communication systems, industrial automation, medical equipment, and military systems.
Altera was known for its innovation in the PLD market, including the development of high-density FPGAs and low-power, high-performance CPLDs. With its acquisition by Intel, Altera continues to provide PLD solutions for its customers, leveraging the resources and technology of one of the world's largest technology companies.
*This information is for general informational purposes only, we will not be liable for any loss or damage caused by the above information.
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Switching Voltage Regulators 4A High Eff Buck Con Integrated Inductor
Pin Count--------39
Part Category--------Integrated Circuit
Package Category--------Other
Footprint Name--------Other - EN6347QI-1
Pin Count--------39
Part Category--------Integrated Circuit
Package Category--------Other
Footprint Name--------Other - EN6347QI-1
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EN6347QI Frequently Asked Questions (FAQs)
What is the recommended PCB layout for optimal thermal performance?
A 4-layer PCB with a dedicated ground plane and thermal vias is
recommended for optimal thermal performance. Ensure that the thermal pad is connected to a solid ground plane to dissipate heat efficiently.
How do I ensure reliable operation across the entire temperature range?
To ensure reliable operation across the entire temperature range, follow the recommended operating conditions, and consider using thermal management techniques such as heat sinks, thermal interfaces, and airflow management.
What are the guidelines for power sequencing and voltage ramp-up?
Power sequencing should follow the recommended power-up sequence: VCC, then VCCIO, and finally VREF. Ensure a slow voltage ramp-up (typically 1-2 ms) to prevent damage to the device.
How do I handle ESD protection and latch-up prevention?
Implement ESD protection using TVS diodes or ESD arrays on the I/O lines. For latch-up prevention, ensure that the device is operated within the recommended operating conditions, and consider using a latch-up protection circuit if necessary.
What are the considerations for signal integrity and PCB routing?
Follow best practices for signal integrity by using controlled impedance routing, minimizing signal lengths, and avoiding signal crossing. Use a signal integrity analysis tool to optimize PCB routing.
What is the recommended PCB layout for optimal thermal performance?
A 4-layer PCB with a dedicated ground plane and thermal vias is
recommended for optimal thermal performance. Ensure that the thermal pad is connected to a solid ground plane to dissipate heat efficiently.
How do I ensure reliable operation across the entire temperature range?
To ensure reliable operation across the entire temperature range, follow the recommended operating conditions, and consider using thermal management techniques such as heat sinks, thermal interfaces, and airflow management.
What are the guidelines for power sequencing and voltage ramp-up?
Power sequencing should follow the recommended power-up sequence: VCC, then VCCIO, and finally VREF. Ensure a slow voltage ramp-up (typically 1-2 ms) to prevent damage to the device.
How do I handle ESD protection and latch-up prevention?
Implement ESD protection using TVS diodes or ESD arrays on the I/O lines. For latch-up prevention, ensure that the device is operated within the recommended operating conditions, and consider using a latch-up protection circuit if necessary.
What are the considerations for signal integrity and PCB routing?
Follow best practices for signal integrity by using controlled impedance routing, minimizing signal lengths, and avoiding signal crossing. Use a signal integrity analysis tool to optimize PCB routing.
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